Future multichip packages require Die-to-Die (D2D) interconnects operating at frequencies above 10 GHz; however, the extension of copper interconnects and epoxy dielectrics presents a trade-off between performance and reliability. This paper explores insertion losses and adhesion as a function of interface roughness at frequencies up to 18 GHz. We probe epoxy surface chemistry as a function of curing time and use wet etching to modulate surface roughness. The morphology is quantified by atomic force microscopy (AFM) and two-dimensional fast Fourier transform (2D FFT). Peel test and vector network analysis are used to examine the impacts of both type and level of roughness. The trade-offs between power efficiency and reliability are presented and discussed.

We present a system for recording electromyographic (EMG) signals from songbirds using hybrid polyimide-polydimethylsiloxane (PDMS) flexible multielectrode arrays (MEAs). 2-D electrodes with a diameter of 200, 125, and 50 μm and a center-to-center pitch of 300, 200, and 100 μm, respectively, were fabricated. 3-D MEAs were fabricated using a photoresist reflow process to obtain hemispherical domes utilized to form the 3-D electrodes. Biocompatibility and flexibility of the arrays were ensured by using polyimide and PDMS as the materials of choice for the arrays. EMG activity was recorded from the expiratory muscle group of anesthetized songbirds using the fabricated 2-D and 3-D arrays. Air pressure data were also recorded simultaneously from the air sac of the songbird. Together, EMG recordings and air pressure measurements can be used to characterize how the nervous system controls breathing and other motor behaviors. Such technologies can in turn provide unique insights into motor control in a range of species, including humans. An improvement of over 7× in the signal-to-noise ratio (SNR) is observed with the utilization of 3-D MEAs in comparison to 2-D MEAs.

This study presents the development and characterization of biodegradable electrical interconnects for transient implantable medical devices. The interconnects comprised micropatterned biodegradable conductive polymer composites, which were developed using iron (Fe) microparticles as the conductive filler and polycaprolactone (PCL) as the insulating matrix. The electrical properties of the composites were investigated under various degradation conditions. Electrical percolation was observed at 17% iron volume fraction, but higher volume fractions exhibited more stable electrical resistivity throughout the time course of physiological degradation. The electrical resistivity of 40%vf Fe-PCL composites increased tenfold in an emulated packaged environment under degradation. Biodegradable electrical interconnects based on 40%vf Fe-PCL composites were successfully micropatterned in daisy chain structures, illustrating the process compatibility of Fe-PCL composites for interconnect applications. The electrical resistance of the packaged daisy chain structures exhibited a reasonable increase under degradation. An electrical lifetime of over 5 days was also achieved. System integration with a commercial humidity sensor and analytical calculations supporting other application scenarios confirmed the feasibility of micropatterned Fe-PCL interconnects for use in implantable electrical systems.

Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent microscale/nanoscale devices, and experimental characterization. All of the designs reported here adopt heterogeneous structures of and inorganic materials on and elastomeric substrates, with mechanical design layouts that isolate large deformations to the elastomer, thereby avoiding potentially destructive plastic strains in the brittle materials. The overall stiffnesses of the electronics, their stretchability, and curvilinear shapes can be designed to match the mechanical properties of biological tissues. The result is a class of soft stretchable electronic systems that are compatible with traditional high-performance inorganic semiconductor technologies. These systems afford promising options for applications in portable biomedical and health-monitoring devices. Mechanics theories and modeling play a key role in understanding the underlining physics and optimization of these systems.

This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers that are at most 5 µm larger than the chip on each side. The chip and the large area substrate are bonded onto a carrier such that the top surfaces of the two components are flush. The unique features of this technique enable the integration of macroscale components, such as leads and microfluidics. Furthermore, the integration process allows for MEMS micromachining after CMOS die-wafer integration. To demonstrate the capabilities of the proposed technology, a low-power integrated potentiostat chip for biosensing implemented in the AMI 0.5 µm CMOS technology is integrated in a silicon substrate. The horizontal gap and the vertical displacement between the chip and the large area substrate measured after the integration were 4 µm and 0.5 µm, respectively. A number of 104 interconnects are patterned with high-precision alignment. Electrical measurements have shown that the functionality of the chip is not affected by the integration process.