During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 m/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.

Cryptographic hash functions are security-critical algorithms with many practical applications, notably in digital signatures. Developing an approach to test them can be particularly difficult, and bugs can remain unnoticed for many years. We revisit the NIST hash function competition, which was used to develop the SHA-3 standard, and apply a new testing strategy to all available reference implementations. Motivated by the cryptographic properties that a hash function should satisfy, we develop four tests. The Bit-Contribution Test checks if changes in the message affect the hash value, and the Bit-Exclusion Test checks that changes beyond the last message bit leave the hash value unchanged. We develop the Update Test to verify that messages are processed correctly in chunks, and then use combinatorial testing methods to reduce the test set size by several orders of magnitude while retaining the same fault-detection capability. Our tests detect bugs in 41 of the 86 reference implementations submitted to the SHA-3 competition, including the rediscovery of a bug in all submitted implementations of the SHA-3 finalist BLAKE. This bug remained undiscovered for seven years, and is particularly serious because it provides a simple strategy to modify the message without changing the hash value returned by the implementation. We detect these bugs using a fully-automated testing approach.